EN/CN

Product

WLM1

Characteristic

● Lead-free compatible and Halogen-free material

● High Tg: 180℃ (DMA)

● White Color with high reflectivity of visible light

● Less discoloration after heat treatment and light irradiation

Application Area

● Suitable for LED, COB, IC Package material, mini LED and etc.

  • Product Performance
  • Product Certificate
  • Data Download
Items Condition Unit Typical Value
Whiteness Internal Standard %
88
Tg
DMA

181
Td 5% wt. loss 374
T288
TMA min >60
T260 TMA min
>60
Thermal Stress
288℃, solder dip
- Pass
CTE (Z-axis) Before Tg ppm/℃ 26.8
After Tg ppm/℃ 123.7
50-260℃ % 1.9
CTE (X/Y-axis)
Wrap-α1
ppm/℃
11-13
Fill--α1
ppm/℃
11-13
Arc Resistance D-48/50+D-0.5/23 s 180
Dielectric Breakdown D-48/50+D-0.5/23 kV 45+kV NB
Peel Strength (1Oz) 288℃/10s N/mm 0.93
Flexural Strength(LW/CW) A MPa 480/370
Water Absorption E-1/105+D-24/23 % 0.08
Flammability
C-48/23/50
Rating
HB

Remarks:

1. Specimen thickness: 1.0mm. Test method is according to IPC TM-650.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.