● Tg>190℃ (DSC)
● Dk/Df@1GHz: 3.62/0.0085
● low Z-axis CTE, with good processibility

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Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 190
Tg IPC-TM-650
Td IPC-TM-650 5% wt. loss 345
CTE(Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 50
After Tg ppm/℃ 230
50-260℃ % 2.5
T260 IPC-TM-650 TMA min >60
T288 IPC-TM-650 TMA min 27
Thermal Stress IPC-TM-650 288℃, solder dip --


Dissipation Constant (Dk) IPC-TM-650 1GHz -- 3.8
IEC 61189-2-721 10GHz -- 3.92
Dissipation Factor (Df) IPC-TM-650 1GHz -- 0.0070
IEC 61189-2-721 10GHz -- 0.0087
Peel Strength(1oz RTF copper foil)
IPC-TM-650 2.4.8
After thermal Stress 288℃,10s N/mm 1.1
Water Absorption IPC-TM-650 E-1/105+D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0


1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.