EN/CN

Product

Synamic 6

Characteristic

● Tg 210℃ (DMA)
● Low Dk/Df
● Td>400℃, T300>60min
● Low Z-axis CTE with good PCB processibility
● Low moisture absorption and excellent thermal reliability
● Lead-free compatible

Application Area

● Server, switch, storage, routers and base station BBU...

● Optical networking products

● high frequency application

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 210
Tg 2.4.25D DSC
190
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min 120
T260 2.4.24.1
TMA min
60
Thermal Stress
2.4.13.1
288℃, solder dip
- >10s
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 55
After Tg ppm/℃ 230
50-260℃ % 2.0
Dissipation Constant 2.5.5.9(1GHz) C-24/23/50 -

3.64

2.5.5.5(10GHz)
C-24/23/50
- 3.58
SPDR(10GHz)
C-24/23/50
- 3.92
Dissipation Factor
2.5.5.9(1GHz)
C-24/23/50
- 0.0021
2.5.5.5(10GHz)
C-24/23/50
- 0.0036
SPDR (10GHz)
C-24/23/50
- 0.0046
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 0.85
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.09
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

1.All the typical value is based on 0.76mm(6*2116)thickness specimen.


2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi TechnologyCo., Ltd.

E Remarks: C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning.

T The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.