EN/CN

Product

Synamic 6N

Characteristic

● Tg 205℃ (DMA)
● Low Dk/Df
● Td>400℃, T300>60min
● Low Z-axis CTE
● Low moisture absorption, excellent thermal reliability
● Lead-free compatible

Application Area

● ~56Gbps HSD networking equipment

● Server, Switch, Storage, Routers, Base station BBU...

● High performance super computer

● High frequency application

● Optical communication

  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 205
2.4.25D DSC
190
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min 120
T260 2.4.24.1
TMA min
60
Thermal Stress
2.4.13.1
288℃, solder dip
- >10s
Humidity Resistant
-
85℃/85%RH, 168hr,
cycle
>10
- 288℃/10sec, Dipping
>10
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 56
After Tg ppm/℃ 232
50-260℃ % 2.1
Dissipation Constant 2.5.5.9(1GHz) C-24/23/50 -

3.31

2.5.5.5(10GHz)
C-24/23/50
- 3.25
SPDR(10GHz)
C-24/23/50
- 3.42
Dissipation Factor
2.5.5.9(1GHz)
C-24/23/50
- 0.0013
2.5.5.5(10GHz)
C-24/23/50
- 0.0021
SPDR(10GHz)
C-24/23/50
- 0.0026
Peel Strength (1oz) 2.4.8 288℃/10s N/mm 0.82
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.09
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

1. All the typical value is based on the 0.76mm (6*2116) thickness specimen.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.